Re: TI-H: *Great News*

Re: TI-H: *Great News*

• To: <ti-hardware@lists.ticalc.org>
• Subject: Re: TI-H: *Great News*
• From: "David Knaack" <dknaack@easen.net>
• Date: Wed, 15 Apr 1998 15:52:13 -0500
• Delivered-To: ti-hardware-outgoing@towerguard.unix.edu.sollentuna.se
• Reply-To: ti-hardware@lists.ticalc.org

From: John Malluck <malluck@bellsouth.net>
>    I have great news concerning the new case designs you guys were
<snip>

This would be really neat.  I would be intrested in getting a new
back panel that is just thicker than the original case.  That
would give lots of room for more stuff inside, leave the original
look of the front unchanged, and allow the front slide to fit.

Any restrictions on the design, like the jointed-mold stuff?

DK

• Re: TI-H: *Great News*
• From: John Malluck <malluck@bellsouth.net>
• Re: TI-H: *Great News*
• From: Richard Piotter <richfile@prairie.lakes.com>

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